CXP5086 查看數據表（PDF） - Sony Semiconductor

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CXP5086

CMOS 4-bit Single Chip Microcomputer

Sony Semiconductor 

Package Outline

Unit: mm

64

64PIN SDIP (PLASTIC)

+ 0.4

57.6 – 0.1

33

1

32

1.778

0° to 15°

0.5 ± 0.1

0.9 ± 0.15

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-64P-01

SDIP064-P-0750

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

PACKAGE MASS

42 ALLOY

8.6g

64PIN QFP(PLASTIC)

51

52

23.9 ± 0.4

+ 0.4

20.0 – 0.1

33

32

+ 0.1

0.15 – 0.05

0.15

CXP5084/5086

64

1

1.0

19

+ 0.15

0.4 – 0.1

20

+ 0.2

0.1 – 0.05

+ 0.35

2.75 – 0.15

0.2 M

0° to10°

SONY CODE

EIAJ CODE

JEDEC CODE

QFP-64P-L01

QFP064-P-1420

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

EPOXY RESIN

SOLDER/PALLADIUM

PLATING

42/COPPER ALLOY

PACKAGE MASS

1.5g

– 11 –

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