BUK7507-30B 查看數據表（PDF） - Philips Electronics
零件编号
产品描述 (功能)
比赛名单
BUK7507-30B Datasheet PDF : 15 Pages
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Philips Semiconductors
Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
4.1
Transient thermal impedance . . . . . . . . . . . . . . 4
5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 14
10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
BUK75/7607-30B
TrenchMOS™ standard level FET
© Koninklijke Philips Electronics N.V. 2003.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 07 April 2003
Document order number: 9397 750 11232
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