EL7564 查看數據表（PDF） - Renesas Electronics
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EL7564 Datasheet PDF : 17 Pages
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EL7564
Typical Performance Curves (Continued)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD. HTSSOP EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
3.5
3 3.333W
2.5
2
1.5
1
0.5
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Block Diagram
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1
0.9
909mW
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
0.1µF
390pF
VREF
COSC
2.2nF
22
VTJ
JUNCTION
TEMPERATURE
CONTROLLER
SUPPLY
VDD
VOLTAGE
REFERENCE
OSCILLATOR
0.22µF
EN
STP
STN
PWM
CONTROLLER
POWER
FET
DRIVERS
POWER
FET
POWER
TRACKING
SGND
FB
CURRENT
SENSE
VREF -
+
VDRV
VHI
VIN
0.22µF
4.7µH
PGND
D1
330µF
2370
VOUT
100pF
1k
PG
FN7297 Rev 3.00
May 9, 2005
Page 9 of 17
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