STLVDS3486(2006) 查看數據表（PDF） - STMicroelectronics

零件编号

产品描述 (功能)

比赛名单

STLVDS3486
(Rev.:2006)

High speed differential line drivers

STMicroelectronics 

STLVDS3486

7

Package mechanical data

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

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