HCS573D 查看數據表（PDF） - Intersil
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HCS573D Datasheet PDF : 10 Pages
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Die Characteristics
DIE DIMENSIONS:
101 x 85 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
D0
(2)
HCS573MS
HCS573MS
OE
VCC
Q0
(1)
(20)
(19)
D1 (3)
D2 (4)
D3 (5)
D4 (6)
D5 (7)
D6 (8)
(9)
(10)
(11)
(12)
D7
GND
LE
Q7
333
(18) Q1
(17) Q2
(16) Q3
(15) Q4
(14) Q5
(13) Q6
Spec Number 518771
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