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NCV8184 查看數據表(PDF) - ON Semiconductor

零件编号
产品描述 (功能)
比赛名单
NCV8184 Datasheet PDF : 20 Pages
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Parameter
SOIC8 Package
JunctiontoPin 6 (YJL6, YJL6)
JunctiontoAmbient (RqJA, qJA)
Package construction
Without mold compound
NCV8184
PACKAGE THERMAL DATA
Conditions
Typical Value
100 mm2 Spreader Board
645 mm2 Spreader Board
1 oz
2 oz
1 oz
2 oz
53
51
50
47
151
135
111
100
Units
°C/W
°C/W
Figure 24. PCB Layout and Package Construction for Simulation
http://onsemi.com
8

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