CS8127 查看數據表（PDF） - ON Semiconductor
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CS8127 Datasheet PDF : 8 Pages
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Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
Lead Count
8 Lead SO Narrow
Metric
Max Min
5.00 4.80
D
English
Max Min
.197 .189
Thermal Data
RΘJC
typ
RΘJA
typ
8 Lead
SO Narrow
45
165
°C/W
°C/W
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
3.68 (.145)
2.92 (.115)
8.26 (.325)
7.62 (.300)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
REF: JEDEC MS-001
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
D
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
Surface Mount Narrow Body (D); 150 mil wide
4.00 (.157)
3.80 (.150)
6.20 (.244)
5.80 (.228)
0.51 (.020)
0.33 (.013)
1.27 (.050)
0.40 (.016)
0.25 (.010)
0.19 (.008)
1.57 (.062)
1.37 (.054)
REF: JEDEC MS-012
1.27 (.050) BSC
1.75 (.069) MAX
0.25 (0.10)
0.10 (.004)
D
Ordering Information
Part Number
CS8127YD8
CS8127YDR8
Description
8 Lead SO Narrow
8 Lead SO Narrow (tape & reel)
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