C106 Series
THERMAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction to Case
RθJC
3.0
°C/W
Thermal Resistance, Junction to Ambient
RθJA
75
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds
TL
260
°C/W
°C
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current
IDRM, IRRM
(VAK = Rated VDRM or VRRM, RGK = 1000 Ohms)
TJ = 25°C
–
TJ = 110°C
–
ON CHARACTERISTICS
–
10
µA
–
100
µA
Peak Forward On–State Voltage (Note 3)
(ITM = 4 A)
Gate Trigger Current (Continuous dc) (Note 4)
(VAK = 6 Vdc, RL = 100 Ohms)
Peak Reverse Gate Voltage (IGR = 10 µA)
Gate Trigger Voltage (Continuous dc) (Note 4)
(VAK = 6 Vdc, RL = 100 Ohms)
Gate Non–Trigger Voltage (Continuous dc) (Note 4)
(VAK = 12 V, RL = 100 Ohms, TJ = 110°C)
Latching Current
(VAK = 12 V, IG = 20 mA)
Holding Current (VD = 12 Vdc)
(Initiating Current = 20 mA, Gate Open)
DYNAMIC CHARACTERISTICS
TJ = 25°C
TJ = –40°C
TJ = 25°C
TJ = –40°C
TJ = 25°C
TJ = –40°C
TJ = 25°C
TJ = –40°C
TJ = +110°C
VTM
IGT
VGRM
VGT
VGD
IL
IH
–
–
2.2
Volts
µA
–
15
200
–
35
500
–
–
6.0
Volts
Volts
0.4
0.60
0.8
0.5
0.75
1.0
0.2
–
–
Volts
mA
–
0.20
5.0
–
0.35
7.0
mA
–
0.19
3.0
–
0.33
6.0
–
0.07
2.0
Critical Rate–of–Rise of Off–State Voltage
(VAK = Rated VDRM, Exponential Waveform, RGK = 1000 Ohms,
TJ = 110°C)
3. Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%.
4. RGK is not included in measurement.
dv/dt
–
8.0
–
V/µs
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