ML7012-06 查看數據表（PDF） - LAPIS Semiconductor Co., Ltd.
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ML7012-06 Datasheet PDF : 23 Pages
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PACKAGE DIMENSIONS
QFP64-P-1414-0.80-BK
FEDL7012-06-02
ML7012-06
(Unit: mm)
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (J5μm)
0.87 TYP.
6/Feb. 23, 2001
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact ROHM's responsible sales person for the
product name, package name, pin number, package code, and desired mounting conditions (reflow
method, temperature and times).
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