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T591B336M006ATE080 查看數據表(PDF) - KEMET

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T591B336M006ATE080 Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
KEMET Organic Capacitor (KO-CAP®) – Automotive Grade
T591/T598 High Humidity/High Temperature Automotive Grade Polymer Electrolytic, 2.5 – 50 VDC
Table 2 – Land Dimensions/Courtyard
Metric
KEMET Size
Code
Case
EIA
B
3528–21
D
7343–31
V
7343–20
Density Level A:
Maximum (Most) Land
Protrusion (mm)
W
L
S
V1 V2
2.35 2.21 0.92 6.32 4.00
2.55 2.77 3.67 10.22 5.60
2.55 2.77 3.67 10.22 5.60
Density Level B:
Median (Nominal) Land
Protrusion (mm)
W
L
S V1 V2
2.23 1.80 1.12 5.22 3.50
2.43 2.37 3.87 9.12 5.10
2.43 2.37 3.87 9.12 5.10
Density Level C:
Minimum (Least) Land
Protrusion (mm)
W
L
S V1 V2
2.13 1.42 1.28 4.36 3.24
2.33 1.99 4.03 8.26 4.84
2.33 1.99 4.03 8.26 4.84
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component desity product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351).
1 Height of these chips may create problems in wave soldering.
2 Land pattern geometry is too small for silkscreen outline.
V1
L
L
W
W
V2
S
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
T2073_T591_T598 • 6/5/2017 11

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