MC13770FC 查看數據表（PDF） - NXP Semiconductors.

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MC13770FC

Single Band LNA and Mixer FEIC

NXP Semiconductors. 

5 Packaging Information

Packaging Information

LASER MARK FOR PIN 1

IDENTIFICATION IN

THIS AREA

3

A

2X

0.1 C

M

G

3

2X

B

0.1 C

M

1.0 1.00

0.8 0.75

0.1 C

0.05 C 5

0.05

0.00

(0.5)

(0.24)

C SEATING PLANE

DETAIL G

VIEW ROTATED 90° CLOCKWISE

0.1 M C A B

0.05 M C

12X 0.3

0.18 9

7

0.1 C A B

1.25

0.95

10

12

DETAIL M

PIN 1 IDENTIFIER

EXPOSED DIE

ATTACH PAD

1

1.25

0.95

3

0.1 C A B

12X 0.75

0.5

N

6

4

8X 0.5

VIEW M-M

DETAIL S

4X (0.25)

8X (0.777)

DETAIL M

PIN 1 BACKSIDE IDENTIFIER

2X

0.39

0.31

(90°)

2X

0.1

0.0

DETAIL S

PIN 1 BACKSIDE IDENTIFIER

12X

0.065

0.015

8X (1.177)

4X (45°)

3X (R0.09)

4X (0.18)

DETAIL N

CORNER CONFIGURATION

4

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

3. THE COMPLETE JEDEC DESIGNATOR FOR THIS

PACKAGE IS: HF-PQFP-N.

4. CORNER CHAMFER MAY NOT BE PRESENT.

DIMENSIONS OF OPTIONAL FEATURES ARE FOR

REFERENCE ONLY.

5. COPLANARITY APPLIES TO LEADS, CORNER LEADS,

AND DIE ATTACH PAD.

Figure 4. Outline Dimensions for QFN-12

(Case 1345-01, Issue A)

MC13770 Technical Data, Rev. 2

Freescale Semiconductor

7

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