ISL97636 查看數據表（PDF） - Renesas Electronics

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ISL97636

8-Channel LED Driver

Renesas Electronics 

ISL97636

Absolute Maximum Ratings (TA = +25°C)

VIN, FAULT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 24V

VDC, COMP, RSET, EN/PWM . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V

OVP, IIN0 - IIN7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 28V

LX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 36V

PGND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V

Above voltage ratings are all with respect to GND pin

Operating Conditions

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C

Thermal Information

Thermal Resistance (Typical, Notes 1, 2) JA (°C/W) JC (°C/W)

24 Ld QFN . . . . . . . . . . . . . . . . . . . . . .

39

2

Thermal Characterization (Typical, Note 3)

PSIJT (°C/W)

24 Ld QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ~0.7

Maximum Continuous Junction Temperature . . . . . . . . . . . . +125°C

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C

Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests

are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and

result in failures not covered by warranty.

NOTES:

1. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech

Brief TB379.

2. For JC, the “case temp” location is the center of the exposed metal pad on the package underside assumed under ideal case temperature.

3. PSIJT is the junction-to-top thermal resistance. If the package top temperature can be measured, with this rating then the die junction temperature

can be estimated more accurately than the JC and JC thermal resistance ratings.

4. Limits established by characterization and are not production tested.

Electrical Specifications

All specifications below are tested at TA = -40°C to +85°C; VIN = 12V, EN = 5V, RSET = 36.6k; Parameters

with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits

established by characterization and are not production tested.

PARAMETER

DESCRIPTION

CONDITION

MIN

TYP

MAX

UNIT

GENERAL

VIN

Backlight Supply Voltage

 9 LEDs per channel

6

(3.5V/30mA type)

24

V

IVIN_STBY

VIN Shutdown Current

5

µA

VOUT

Vuvlo

Output Voltage

Undervoltage Lockout Threshold

34.5

V

2.45

2.8

V

Vuvlo_hys

Undervoltage Lockout Hysteresis

300

mV

SS

Soft-start

1

ms

PWM GENERATOR

EN/PWM

EN/PWM Voltage Range

2.7

5.5

V

ENmin

Minimum Enable Signal

40

µs

tMAX_PWM_OFF Maximum PWMI Off Time Before

Shutdown

EN/PWMI toggles

28

ms

REGULATOR

VDC

IVDC_STBY

LDO Output Voltage

Standby Current

VIN > 6V

5.0

EN/PWM = 0V

5.5

V

20

µA

IVDC

Active Current

EN/PWM = 5V

10

mA

VLDO

BOOST

VDC LDO Dropout Voltage

VIN > 5.5V, 30mA

30

200

mV

SWILimit

rDS(ON)

Boost FET Current Limit

Internal Boost Switch ON-Resistance

TA = +25°C

TA = -40°C, +85°C

2.3

3.2

A

2.2

A

130

260

m

FN6570 Rev 0.00

May 9, 2008

Page 4 of 18

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