AD1671-703D 查看數據表（PDF） - Analog Devices

零件编号

产品描述 (功能)

比赛名单

AD1671-703D

12-Bit A/D Converter

Analog Devices 

AD1671

3.0 Absolute Maximum Ratings. (TA = 25°C, unless otherwise noted)

VCC to ACOM.............................................................................................................-0.5V to +6.5V

VEE to ACOM.............................................................................................................-6.5V to +0.5V

VLOGIC to DCOM.........................................................................................................-0.5V to +6.5V

ACOM to DCOM........................................................................................................-1.0V to +1.0V

VCC to VLOGIC ..............................................................................................................-6.5V to +6.5V

ENCODE to DCOM....................................................................................................-0.5V to VLOGIC +0.5V

REF IN, BPO/UPO to ACOM ....................................................................................-0.5V to VCC +0.5V

AIN to ACOM.............................................................................................................-11V to +11V

Power Dissipation .....................................................................................................1000mW

Operating Temperature Range..................................................................................-55°C to +125°C

Storage Temperature Range.....................................................................................-65°C to +150°C

Lead Temperature (Soldering, 60 sec.) ....................................................................+300°C

Junction Temperature (TJ).........................................................................................+150°C

3.1. Thermal Characteristics:

Thermal Resistance, SBDIP (D) Package

Junction-to-Case (ΘJC) = 28°C/W Max

Junction-to-Ambient (ΘJA) = 60°C/W Max

Thermal Resistance, Bottom brazed (F) Package

Junction-to-Case (ΘJC) = 22°C/W Max

Junction-to-Ambient (ΘJA) = 60°C/W Max

Figure 2. Functional block diagram

ASD0010777 Rev. M | Page 2 of 7

Share Link: