IRFE9110 查看數據表（PDF） - International Rectifier

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IRFE9110

REPETITIVE AVALANCHE AND dv/dt RATED HEXFETTRANSISTORS SURFACE MOUNT (LCC-18)

International Rectifier 

IRFE9110

Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)

BVDSS

∆BVDSS/∆TJ

RDS(on)

VGS(th)

gfs

IDSS

Parameter

Drain-to-Source Breakdown Voltage

Temperature Coefficient of Breakdown

Voltage

Static Drain-to-Source On-State

Resistance

Gate Threshold Voltage

Forward Transconductance

Zero Gate Voltage Drain Current

IGSS

IGSS

Qg

Qgs

Qgd

td(on)

tr

td(off)

tf

LS + LD

Gate-to-Source Leakage Forward

Gate-to-Source Leakage Reverse

Total Gate Charge

Gate-to-Source Charge

Gate-to-Drain (‘Miller’) Charge

Turn-On Delay Time

Rise Time

Turn-Off Delay Time

Fall Time

Total Inductance

Ciss

Coss

Crss

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Min Typ Max Units

-100 — — V

— -0.08 — V/°C

— — 1.2

—

— 1.38 Ω

-2.0 — -4.0 V

0.9 — — S ( )

— — -25

— — -250 µA

—

— -100 nA

— — 100

— — 15

— — 7.0 nC

— — 8.0

— — 30

—

— 60 ns

— — 40

— — 40

— 6.1 — nH

— 214

— 100 — pF

— 20 —

Test Conditions

VGS = 0V, ID = -1.0mA

Reference to 25°C, ID = -1.0mA

VGS = -10V, ID = -1.6A➃

VGS = -10V, ID = -2.5A ➃

VDS = VGS, ID = -250µA

VDS > -15V, IDS = -1.6A➃

VDS= -80V, VGS= 0V

VDS =-80V

VGS = 0V, TJ = 125°C

VGS =-20V

VGS =20V

VGS =-10V, ID= -2.5A

VDS =-50V

VDD =-50V, ID = -2.5A,

VGS =-10V, RG =7.5Ω

Measured from the center of

drain pad to center of source

pad

VGS = 0V, VDS = -25V

f = 1.0MHz

Source-Drain Diode Ratings and Characteristics

Parameter

Min Typ Max Units

IS

Continuous Source Current (Body Diode)

ISM Pulse Source Current (Body Diode) ➀

— — -2.5 A

— — -10

Test Conditions

VSD

trr

QRR

ton

Diode Forward Voltage

Reverse Recovery Time

Reverse Recovery Charge

Forward Turn-On Time

— — -5.5 V

Tj = 25°C, IS = -2.5A, VGS = 0V ➃

— — 200 nS Tj = 25°C, IF = -2.5A, di/dt ≤-100A/µs

— — 380 µc

VDD ≤ -50V ➃

Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.

Thermal Resistance

Parameter

RthJC

RthJ-PCB

Junction to Case

Junction to PC Board

For footnotes refer to the last page

2

Min Typ Max Units

Test Conditions

— — 8.3

°C/W

— — 27

Soldered to a copper clad PC board

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