LMA411 查看數據表（PDF） - Filtronic PLC

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LMA411

LOW NOISE PHEMT MMIC

Filtronic PLC 

• ASSEMBLY DRAWING

LMA411

LOW NOISE PHEMT MMIC

50% of Idss BIAS

Notes:

• Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The

bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is

recommended. Ultrasonic bonding is not recommended.

• The recommended die attach is a eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290°C.

Maximum time at temperature is 1 minute. Use of forming gas (90% N2 , 10% H2 ) for best results.

• Bond on bond or stitch bond acceptable.

• Conductor over conductor acceptable. Conductors must not short.

Phone: (408) 988-1845

Fax: (408) 970-9950

http:// www.filss.com

Revised: 09/07/01

Email: sales@filss.com

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