NL37WZ16MU3TCG 查看數據表（PDF） - ON Semiconductor

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NL37WZ16MU3TCG

Triple Buffer

ON Semiconductor 

NL37WZ16

PACKAGE DIMENSIONS

−X−

A

8

5

−Y−

B

L

1

4

P

G

−T−

SEATING

PLANE

C

K

D

0.10 (0.004) M T X Y

US8

US SUFFIX

CASE 493−02

ISSUE B

J

DETAIL E

R

S

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION “A” DOES NOT INCLUDE MOLD

FLASH, PROTRUSION OR GATE BURR.

MOLD FLASH. PROTRUSION AND GATE

BURR SHALL NOT EXCEED 0.140 MM

(0.0055”) PER SIDE.

4. DIMENSION “B” DOES NOT INCLUDE

INTER−LEAD FLASH OR PROTRUSION.

INTER−LEAD FLASH AND PROTRUSION

SHALL NOT E3XCEED 0.140 (0.0055”) PER

SIDE.

5. LEAD FINISH IS SOLDER PLATING WITH

THICKNESS OF 0.0076−0.0203 MM.

(300−800 “).

6. ALL TOLERANCE UNLESS OTHERWISE

SPECIFIED ±0.0508 (0.0002 “).

U

0.10 (0.004) T

V

H

N

R 0.10 TYP

M

F

DETAIL E

SOLDERING FOOTPRINT*

MILLIMETERS

INCHES

DIM MIN MAX MIN MAX

A 1.90 2.10 0.075 0.083

B 2.20 2.40 0.087 0.094

C 0.60 0.90 0.024 0.035

D 0.17 0.25 0.007 0.010

F 0.20 0.35 0.008 0.014

G

0.50 BSC

0.020 BSC

H

0.40 REF

0.016 REF

J 0.10 0.18 0.004 0.007

K 0.00 0.10 0.000 0.004

L 3.00 3.20 0.118 0.126

M

0_ 6_ 0_ 6_

N

5 _ 10 _ 5 _ 10 _

P 0.23 0.34 0.010 0.013

R 0.23 0.33 0.009 0.013

S 0.37 0.47 0.015 0.019

U 0.60 0.80 0.024 0.031

V

0.12 BSC

0.005 BSC

3.8

0.015

0.50

1.8

0.0197

0.07

0.30

0.012

1.0

0.0394

ǒ Ǔ SCALE 8:1

mm

inches

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

7

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