RMWT11001 查看數據表（PDF） - Raytheon Company
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RMWT11001 Datasheet PDF : 9 Pages
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Raytheon
RMWT11001
11 to 33 GHz Tripler MMIC
Raytheon Commercial Electronics
Application Information
Caution:
This is an ESD sensitive device
Chip Layout and Bond Pad Locations
Chip Size is 1.6 mm x 1.05 mm Typical. Back of chip is RF ground
0.0
1.05
0.752
0.5955
0.439
1.6
1.05
0.752
0.5955
0.439
0.0
0.0
Dimensions in mm
0.0
1.6
Raytheon reserves the right to update or change specifications without notice.
Tel: 978-684-8663
Fax: 978-684-8646
www.raytheon.com/micro
Revised March 14, 2001
Page 6
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
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