Infineon Technologies
PrimePACK™2 module with Trench/Fieldstop IGBT4, enlarged Emitter Controlled 4 diode
HIROSE ELECTRIC
2 × 2.2 mm Pitch, Wire-to-Wire Connectors for Small Spaces
ON Semiconductor
HIROSE ELECTRIC
3.96mm Pitch Connector Directly Mounted on Board
HIROSE ELECTRIC
1.7mm pitch, Low Profile Wire-to-Board Connectors for Power Supplies
HIROSE ELECTRIC
Board-to-Wire Swing-Lock Connector for Low-Profile Power Source
HIROSE ELECTRIC
1.7mm pitch, Low Profile Wire-to-Board Connectors for Power Supplies
ON Semiconductor
Quad Array for ESD Protection