TGA9083-EEU 查看數據表（PDF） - TriQuint Semiconductor

零件编号

产品描述 (功能)

比赛名单

TGA9083-EEU

Power Amplifier

TriQuint Semiconductor 

TGA9083-EEU

MECHANICAL DRAWING

34

5

120.0

115.5

112.0

104.5 A

97.9

B

89.5 C

89.2

E

86.0 D

51.5 1

6 110.0

2 53.5

8.1

5.4

0.0

7

8

Units: millimeters (inches)

Thickness: 0,1016 (0.004) (reference only)

Chip edge to bond pad dimensions are shown to center of bond pad.

Chip size +/- 0,0508 (0.002)

Bond pad #1

Bond pad #2

Bond pad #3

Bond pad #4, #7

Bond pad #5, #8

Bond pad #6, #9

Bond pads A,B,C,D,E

(RF Input)

(RF Output)

(-VAGB )

(-VG)

(VD1)

(VD2)

Center two bond wires equal distance from center line

Center two bond wires equal distance from center line

0,120 x 0,120 (.0047 x .0047)

0,120 x 0,120 (.0047 x .0047)

0,240 x 0,120 (.0094 x .0047)

0,275 x 0,340 (.0108 x .0134)

0,120 x 0,120 (.0047 x .0047)

9 9.7

9

TriQuint Semiconductor, Inc. • Texas Facilities • (972) 995-8465 • www.triquint.com

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