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PI6C185-02 查看數據表(PDF) - Pericom Semiconductor

零件编号
产品描述 (功能)
比赛名单
PI6C185-02
Pericom-Semiconductor
Pericom Semiconductor Pericom-Semiconductor
PI6C185-02 Datasheet PDF : 6 Pages
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PI6C185-02
1122334455667788990011223344556677889900112233445566778899001122112233445566778899001122334455667788990011223344556677889900112211223344556677889900112233445566778899001122334455667788990011221122334455667788P9900r1122e33c4455is6677io8899n001122133-4475566C778899l00o11c2211k2233B4455u6677f88f99e00r1122
Output
Buffer
Test
Point
Test Load
3.3V
Clocking
Interface
(TTL)
2.4
1.5
0.4
tSDKH
tSDKP
tSDRISE
tSDFALL
tSDKL
Input
Waveform
1.5V
tplh
Output
Waveform
1.5V
1.5V
tphl
1.5V
Figure 1. Clock Waveforms
Minimum and Maximum Expected Capacitive Loads
Clock Min Load Max Load Units
Notes
SDRAM 20
30
pF SDRAM DIMM Specification
Notes:
1. Maximum rise/fall times are guaranteed at maximum specified load.
2. Minimum rise/fall times are guaranteed at minimum specified load.
3. Rise/fall times are specified with pure capacitive load as shown.
Testing is done with an additional 500resistor in parallel.
Design Guidelines to Reduce EMI
1. Place R series resistors and CI capacitors as close as possible to the respective clock pins. Typical
S
value for CI is 10 pF. RS Series resistor value can be increased to reduce EMI provided that the rise
and fall time are still within the specified values.
2. Minimize the number of “vias” of the clock traces.
3. Route clock traces over a continuous ground plane or over a continuous power plane. Avoid routing
clock traces from plane to plane (refer to rule #2).
4. Position clock signals away from signals that go to any cables or any external connectors.
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PS8371 05/03/00

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