ETF6122 查看數據表（PDF） - TriQuint Semiconductor

零件编号

产品描述 (功能)

比赛名单

ETF6122

1 Gigasample/sec, 8-bit Digital-to-Analog Converter

TriQuint Semiconductor 

TQ6122

Figure 10. Package Dimensions

0.015

0.050

0.125

0.035

PIN 12

TOP VIEW

0.65

SQUARE

0.805

NOMINAL

PIN 1

Figure 11. Mounting Footprint

PIN 23

All Dimensions in Inches

PIN 12

0.060

0.005

0.025

0.050

0.425

0.350

SOLDER PAD

PIN 34

Package Outline

(For Reference Only)

PIN 1

All Dimensions in Inches

Figure 12. Heat-Sink Mounting Arrangement (heat sink not included)

THERMALLOY TYPE 2291C TOP

Use Loctite “Output” Thermal

Conductive Adhesive (Loctite item

number 00241) or equivalent to

attach heat sink base to IC.

THERMALLOY

TYPE 2291C

BASE

DAC IC

THERMAL

ADHESIVE

For additional information and latest specifications, see our website: www.triquint.com

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