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74HC3G34(2018) 查看數據表(PDF) - NXP Semiconductors.

零件编号
产品描述 (功能)
比赛名单
74HC3G34
(Rev.:2018)
NXP
NXP Semiconductors. NXP
74HC3G34 Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Nexperia
74HC3G34; 74HCT3G34
Triple buffer gate
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
y
Z
8
5
pin 1 index
1
e
4
w
bp
E
c
HE
A A2
A1
detail X
A
X
vA
Q
(A3)
θ
Lp
L
0
5 mm
scale
Dimensions (mm are the original dimensions)
Unit
A
max.
A1
A2
A3
bp
c D(1) E(2) e
HE
L
Lp
Q
v
w
y Z(1) θ
max
0.15 0.85
0.27 0.23 2.1 2.4
3.2
0.40 0.21
0.4 8°
mm nom 1
0.12
0.5
0.4
0.2 0.08 0.1
min
0.00 0.60
0.17 0.08 1.9 2.2
3.0
0.15 0.19
0.1 0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
European
projection
SOT765-1
MO-187
Figure 7.  Package outline SOT765-1 (VSSOP8)
sot765-1_po
Issue date
07-06-02
16-05-31
74HC_HCT3G34
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 11 June 2018
© Nexperia B.V. 2018. All rights reserved.
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