74LVC3G34DC 查看數據表（PDF） - NXP Semiconductors.

零件编号

产品描述 (功能)

比赛名单

74LVC3G34DC

Triple buffer

NXP Semiconductors. 

NXP Semiconductors

74LVC3G34

Triple buffer

3. Ordering information

Table 1. Ordering information

Type number

Package

Temperature range Name Description

Version

74LVC3G34DP

−40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

SOT505-2

74LVC3G34DC

−40 °C to +125 °C VSSOP8 plastic very thin shrink small outline package; 8 leads; SOT765-1

body width 2.3 mm

74LVC3G34GT

−40 °C to +125 °C XSON8 plastic extremely thin small outline package; no leads; SOT833-1

8 terminals; body 1 × 1.95 × 0.5 mm

74LVC3G34GD

−40 °C to +125 °C XSON8U plastic extremely thin small outline package; no leads; SOT996-2

8 terminals; UTLP based; body 3 × 2 × 0.5 mm

74LVC3G34GM

−40 °C to +125 °C XQFN8U plastic extremely thin quad flat package; no leads;

8 terminals; UTLP based; body 1.6 × 1.6 × 0.5 mm

SOT902-1

4. Marking

Table 2. Marking codes

Type number

74LVC3G34DP

74LVC3G34DC

74LVC3G34GT

74LVC3G34GD

74LVC3G34GM

5. Functional diagram

Marking code

V34

Y34

Y34

Y34

Y34

1A

1Y

3Y

3A

2A

2Y

001aah842

Fig 1. Logic symbol

1

1

1

001aah843

Fig 2. IEC logic symbol

A

Y

001aac536

Fig 3. Logic diagram (one gate)

74LVC3G34_7

Product data sheet

Rev. 07 — 9 May 2008

© NXP B.V. 2008. All rights reserved.

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