AD8159 查看數據表（PDF） - Analog Devices
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AD8159 Datasheet PDF : 24 Pages
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AD8159
OUTLINE DIMENSIONS
0.75 1.20
0.60 MAX
16.00 BSC SQ
14.00 BSC SQ
0.45
100
76
76
100
1
75
75
1
PIN 1
TOP VIEW
(PINS DOWN)
EXPOSED
PAD
5.00 SQ
1.05
1.00
0.95
0.15
0.05
0° MIN
0.20
0.09
7°
3.5°
SE ATING
PLANE
0°
0.08 MAX
COPLANARITY
25
26
VIEW A
51
50
51
50
BOTTOM VIEW
(PINS UP)
0.50 BSC
0.27
LEAD PITCH
0.22
0.17
25
26
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE AD8159 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO VEE. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A VEE PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
Figure 45. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD8159ASVZ1
AD8159-EVAL-DC
AD8159-EVAL-AC
1 Z = Pb-free part.
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
100-Lead TQFP_EP
DC-Coupled Evaluation Board
AC-Coupled Evaluation Board
Package Option
SV-100-4
Rev. A | Page 22 of 24
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