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AS5030 查看數據表(PDF) - austriamicrosystems AG

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AS5030 Datasheet PDF : 44 Pages
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AS5030
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
VDD
Supply voltage
VIN
Input pin voltage
Iscr
Input current (latch-up immunity)
Electrostatic Discharge
-0.3
7
V
VSS - 0.5 VDD + 0.5 V
-100
100
mA
Except during OTP programming
Norm: Jedec 78
ESD
Electrostatic Discharge
±2
kV
Norm: MIL 883 E method 3015
ΘJA
Package thermal resistance
137
°C/W
89
°C/W
Still Air / Single Layer PCB
Still Air / Multilayer PCB
Temperature Ranges and Storage Conditions
Tstrg
Storage temperature
TBODY
Body temperature
-55
+150
°C
Min -67ºF; Max +257ºF
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD-020
260
°C
“Moisture/Reflow Sensitivity Classification
for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages
is matte tin (100% Sn).
Humidity non-condensing
5
85
%
MSL
Moisture Sensitive Level
3
Represents a maximum floor time of 168h
www.ams.com/AS5030
Revision 2.4
5 - 44

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