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CXA2019 查看數據表(PDF) - Sony Semiconductor

零件编号
产品描述 (功能)
比赛名单
CXA2019
Sony
Sony Semiconductor Sony
CXA2019 Datasheet PDF : 30 Pages
First Prev 21 22 23 24 25 26 27 28 29 30
Package Outline
Unit: mm
30
31
40PIN QFP (PLASTIC)
9.0 ± 0.4
+ 0.4
7.0 – 0.1
21
20
CXA2019AQ
+ 0.35
1.5 – 0.15
+ 0.1
0.127 – 0.05
0.1
A
40
1
0.65
+ 0.15
0.1 – 0.1
11
10
+ 0.15
0.3 – 0.1
± 0.12 M
SONY CODE
EIAJ CODE
JEDEC CODE
DETAIL A
QFP-40P-L01
QFP040-P-0707
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER / PALLADIUM
PLATING
42/COPPER ALLOY
PACKAGE MASS
0.2g
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
– 30 –

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