FAN5069(2005) 查看數據表（PDF） - Fairchild Semiconductor
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FAN5069 Datasheet PDF : 20 Pages
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Absolute Maximum Ratings (Note1)
Parameter
VCC to PGND
BOOT to PGND
SW to PGND
Continuous
Transient (t < 50nS, F < 500kHz)
HDRV (VBOOT--VSW)
LDRV
All Other Pins
Maximum Shunt Current for VCC
Electrostatic Discharge Protection (ESD) Level (Note 2)
HBM
CDM
Min.
-0.5
-3
-0.5
-0.3
2
0.4
Max.
6
33
33
33
6
6
VCC+0.3
150
Unit
V
V
V
V
V
V
V
mA
kV
Thermal Information
Parameter
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Vapor Phase, 60 Second
Infrared, 15 Seconds
Power Dissipation (PD), TA = 25°C
Thermal Resistance- Junction to Case(θJC)
Thermal Resistance- Junction to Ambient (θJA) (Note 3)
Min.
-65
Typ.
37
100
Max.
150
300
215
220
715
Unit
°C
°C
°C
°C
mW
°C/W
°C/W
Recommended Operating Conditions
Parameter
Supply Voltage (VCC)
Ambient Temperature (TA)
Junction Temperature (TJ)
Conditions
VCC to GND
Commercial
Industrial
Min.
4.5
-10
-40
Typ.
5
Max.
5.5
85
85
125
Unit
V
°C
°C
°C
Notes:
1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational section of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified all other voltages are referenced
to AGND.
2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
3. Junction to ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and number of copper
planes, number of vias used, diameter of vias used, available copper surface, and attached heat sink characteristics.
FAN5069 Rev. 1.1.0
4
www.fairchildsemi.com
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