HSP061-4NY8 查看數據表（PDF） - STMicroelectronics

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HSP061-4NY8

4-line ESD protection for high speed lines

STMicroelectronics 

Recommendation on PCB assembly

3

Recommendation on PCB assembly

HSP061-4NY8

Figure 12. Recommended stencil window position

7 µm 7 µm

186 µm

Copper

Thickness:

100 µm

Footprint

Stencil window

Footprint

200 µm

13 µm

13 µm

7 µm

7 µm

374 µm

400 µm

186 µm

200 µm

3.1

Solder paste

1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste recommended.

3. Offers a high tack force to resist component displacement during PCB movement.

4. Use solder paste with fine particles: powder particle size 20-45 µm.

3.2

Placement

1. Manual positioning is not recommended.

2. It is recommended to use the lead recognition capabilities of the placement system, not

the outline centering.

3. Standard tolerance of ±0.05 mm is recommended.

4. 3.5 N placement force is recommended. Too much placement force can lead to

squeezed out solder paste and cause solder joints to short. Too low placement force

can lead to insufficient contact between package and solder paste that could cause

open solder joints or badly centered packages.

5. To improve the package placement accuracy, a bottom side optical control should be

performed with a high resolution tool.

6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is

recommended during solder paste printing, pick and place and reflow soldering by

using optimized tools.

6/9

Doc ID 17414 Rev 5

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