ISL8487 查看數據表（PDF） - Intersil
零件编号
产品描述 (功能)
比赛名单
ISL8487 Datasheet PDF : 13 Pages
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ISL8487, ISL81483, ISL81487
Absolute Maximum Ratings
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Input/Output Voltages
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating
HBM (Per MIL-STD-883, Method 3015.7) . . . . . . . . . . . . . . >7kV
Operating Conditions
Temperature Range
ISL8XXXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Thermal Information
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
170
8 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . .
140
Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25°C,
(Note 2)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C) MIN
TYP MAX UNITS
DC CHARACTERISTICS
Driver Differential VOUT (no load)
Driver Differential VOUT (with load)
VOD1
VOD2
R = 50Ω (RS-422), (Figure 1)
R = 27Ω (RS-485), (Figure 1)
Full
-
Full
2
-
VCC
V
3
-
V
Full
1.5
2.3
5
V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
ΔVOD R = 27Ω or 50Ω, (Figure 1)
Full
-
0.01 0.2
V
Driver Common-Mode VOUT
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
VOC
ΔVOC
R = 27Ω or 50Ω, (Figure 1)
R = 27Ω or 50Ω, (Figure 1)
Full
-
-
3
V
Full
-
0.01 0.2
V
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
Input Current (A/Y, B/Z), (Note 10)
(ISL81483, ISL81487)
Input Current (A/Y, B/Z), (Note 11)
(ISL8487 Only)
Receiver Differential Threshold
Voltage
VIH
DE, DI, RE
VIL
DE, DI, RE
IIN1
DE, DI, RE
IIN2
DE = 0V, VCC = 4.5 to VIN = 12V
5.5V
VIN = -7V
IIN2
DE = 0V, VCC = 0V
VIN = 12V
VIN = -7V
IIN2
DE = 0V, VCC = 0V, or VIN = 12V
4.5 to 5.5V
VIN = -7V
VTH
-7V ≤ VCM ≤ 12V
Full
2
-
-
V
Full
-
-
0.8
V
Full
-2
-
2
μA
Full
-
-
140 μA
Full
-
-
-120 μA
Full
-
-
180 μA
Full
-
-
-100 μA
Full
-
-
250 μA
Full
-
-
-100 μA
Full -0.2
-
0.2
V
Receiver Input Hysteresis
Receiver Output High Voltage
Receiver Output Low Voltage
Three-State (high impedance)
Receiver Output Current
ΔVTH
VOH
VOL
IOZR
VCM = 0V
IO = -4mA, VID = 200mV
IO = -4mA, VID = 200mV
0.4V ≤ VO ≤ 2.4V
25
-
70
-
mV
Full
3.5
-
-
V
Full
-
-
0.4
V
Full
-
-
±1
μA
4
FN6050.7
July 31, 2006
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