IT1 查看數據表（PDF） - HIROSE ELECTRIC

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IT1

High Speed, Matched-Impedance, Parallel Board-to-board Connector

HIROSE ELECTRIC 

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

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4. Mating Procedure

Follow the procedure described below.

Note:¡The transmission module must be fully inserted into receptacle assembly already placed and soldered to a board.

¡The Transmission Module cannot be exposed to heat temperatures of the soldering process.

Step 1

Receptacle Placement on the board –

stationary side

Assure that the orientation posts are aligned

with the holes on the board.

When specifying receptacle assemblies without

the orientation posts exercise extra caution to

assure correct orientation and connection with

the solder pads.

Step 2

Insertion of the Transmission Module

Fully insert the Transmission Module in the

board-installed receptacle assembly.

It is critical that the insertion is done straight

and uniformly.

Step 3

Mating/un-mating

Assure that the receptacle assembly is correctly

aligned with the Transmission Module.

Fully insert the receptacle assembly on the

Transmission Module.

It is critical that the insertion is done straight

and uniformly.

Step 4

Connection completed

A307

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