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L6206Q 查看數據表(PDF) - STMicroelectronics

零件编号
产品描述 (功能)
比赛名单
L6206Q
ST-Microelectronics
STMicroelectronics ST-Microelectronics
L6206Q Datasheet PDF : 27 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Pin connection
2
Pin connection
Figure 2. Pin connection (top view)
L6206Q
48 47 46 45 44 43 42 41 40 39 38 37
NC 1
OUT1A 2
EPAD
OUT1A 3
NC 4
NC 5
GND 6
NC 7
NC 8
NC 9
OUT1B 10
OUT1B 11
NC 12
36 NC
35 VSA
34 VSA
33 NC
32 NC
31 GND
30 NC
29 NC
28 NC
27 VSB
26 VSB
25 NC
13 14 15 16 17 18 19 20 21 22 23 24
1. The exposed PAD must be connected to GND pin.
AM02556v1
Pin
Name
Type
Table 3. Pin description
Function
43
44
45, 46
48
2, 3
6, 31
10, 11
13
15, 16
17
IN1A
IN2A
SENSEA
OCDA
OUT1A
GND
OUT1B
OCDB
SENSEB
IN1B
Logic input Bridge A logic input 1.
Logic input Bridge A logic input 2.
Power supply
Bridge A source pin. This pin must be connected to power ground
directly or through a sensing power resistor.
Bridge A overcurrent detection and thermal protection pin. An internal
Open-drain output open-drain transistor pulls to GND when overcurrent on bridge A is
detected or in case of thermal protection.
Power output Bridge A output 1.
GND
Signal ground terminals. These pins are also used for heat dissipation
toward the PCB.
Power output Bridge B output 1.
Bridge B overcurrent detection and thermal protection pin. An internal
Open-drain output open-drain transistor pulls to GND when overcurrent on bridge B is
detected or in case of thermal protection.
Power supply
Bridge B source pin. This pin must be connected to power ground
directly or through a sensing power resistor.
Logic input Bridge B input 1
4/27
DocID022028 Rev 3

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