LIS3DSH 查看數據表（PDF） - STMicroelectronics

零件编号

产品描述 (功能)

比赛名单

LIS3DSH

MEMS digital output motion sensor ultra low-power high performance three-axis “nano” accelerometer

STMicroelectronics 

LIS3DSH

4

Application hints

Figure 5. LIS3DSH electrical connection

Vdd

Application hints

10µF

100nF

Vdd_IO

16

1

14

13

NC

NC

TOP VIEW

INT1/DRDY

5

6

9

8

INT 2

GND

Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO

AM10211V1

The device core is supplied through the Vdd line while the I/O pins are supplied through the

Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 µF) should be placed

as near as possible to pin 14 of the device (common design practice).

All the voltage and ground supplies must be present at the same time to have proper

behavior of the IC (refer to Figure 5). It is possible to remove Vdd maintaining Vdd_IO

without blocking the communication bus, in this condition the measurement chain is

powered off.

The functionality of the device and the measured acceleration data is selectable and

accessible through the I2C or SPI interfaces. When using the I2C, CS must be tied high.

4.1

Soldering information

The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.

It is qualified for soldering heat resistance according to JEDEC J-STD-020.

Leave “Pin 1 Indicator” unconnected during soldering.

Land pattern and soldering recommendations are available at www.st.com.

Doc ID 022405 Rev 1

19/53

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