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LSM330DLC 查看數據表(PDF) - STMicroelectronics

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LSM330DLC Datasheet PDF : 66 Pages
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Module specifications
LSM330DLC
Table 3. Mechanical characteristics (continued)
Symbol
Parameter
Test conditions
Min.
Rn Rate noise density
FS = ±250 dps, BW = 50 Hz
Top Operating temperature range
-40
1. Typical specifications are not guaranteed.
2. Verified by wafer level test and measurement of initial offset and sensitivity.
3. Typical zero-g level offset value after MSL3 preconditioning.
4. Offset can be eliminated by enabling the built-in high-pass filter.
Typ.(1)
0.03
Max.
+85
Unit
dps/ Hz
°C
2.2
Electrical characteristics
@ Vdd = 3 V, T = 25 °C unless otherwise noted
Table 4. Electrical characteristics
Symbol
Parameter
Test conditions
Min.
Typ.(1)
Max.
Unit
Vdd
Vdd_IO
Supply voltage
Power supply for I/O
LA_Idd
Accelerometer current
consumption in Normal mode
Accelerometer current
LA_IddLowP consumption in Low power
mode
Accelerometer current
LA_IddPdn consumption in Power-down
mode
G_Idd
Gyroscope current
consumption in Normal mode
ODR = 50 Hz
ODR = 1 Hz
ODR = 50 Hz
2.4
3.6
V
1.71
Vdd+0.1
V
11
µA
2
6
µA
0.5
µA
6.1
mA
G_IddLowP
Gyroscope supply current
in Sleep mode(2)
G_IddPdn
Gyroscope current
consumption in Power-down
mode
VIH
Digital high level input voltage
VIL
Digital low level input voltage
VOH
High level output voltage
VOL
Low level output voltage
Top
Operating temperature range
2
mA
5
µA
0.8*Vdd_IO
0.9*Vdd_IO
-40
V
0.2*Vdd_IO V
V
0.1*Vdd_IO V
+85
°C
1. Typical specifications are not guaranteed.
2. Sleep mode introduces a faster turn-on time compared to Power-down mode.
14/66
Doc ID 022162 Rev 2

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