NLAS1053 查看數據表（PDF） - ON Semiconductor
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NLAS1053 Datasheet PDF : 10 Pages
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NLAS1053
MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Positive DC Supply Voltage
Digital Input Voltage (Select and Inhibit)
Analog Output Voltage (VCH or VCOM)
DC Current, Into or Out of Any Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance
Power Dissipation in Still Air at 85_C
Moisture Sensitivity
VCC
VIN
VIS
IIK
TSTG
TL
TJ
qJA
PD
MSL
−0.5 to +7.0
−0.5 ≤ V is ≤ +7.0
−0.5 ≤ V is ≤ VCC +0.5
50
−65 to +150
260
+150
250
250
Level 1
V
V
V
mA
_C
_C
_C
_C/W
mW
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 30% − 35%
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
FR
VESD
UL 94 V−0 @ 0.125 in
> 2000
V
200
N/A
Latchup Performance
Above VCC and Below GND at 85_C (Note 5)
ILatchup
±300
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Characteristics
Positive DC Supply Voltage
Digital Input Voltage (Select and Inhibit)
Static or Dynamic Voltage Across an Off Switch
Analog Input Voltage (CH, COM)
Operating Temperature Range, All Package Types
Input Rise or Fall Time
(Enable Input)
Vcc = 3.3 V ± 0.3 V
Vcc = 5.0 V ± 0.5 V
Symbol
VCC
VIN
VIO
VIS
TA
tr, tf
Min
2.0
GND
GND
GND
−55
0
0
Max
5.5
5.5
VCC
VCC
+125
100
20
Unit
V
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS TIME
TO 0.1% BOND FAILURES
Junction
Temperature 5C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 2. Failure Rate versus
Time Junction Temperature
http://onsemi.com
2
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