TGA4506 查看數據表（PDF） - TriQuint Semiconductor

零件编号

产品描述 (功能)

比赛名单

TGA4506

K Band Low Noise Amplifier

TriQuint Semiconductor 

Mechanical Drawing

TGA4506

.82 [0.032]

.73 [0.029]

23

.41 [0.016]

1

4

5

6

7

.48 [0.019]

.09 [0.004]

11

.00 [0.000]

10 9 8

.08 [0.003]

Units: millimeters [inches]

Thickness: 0.10 [0.004] (reference only)

Chip edge to bond pad dimensions are shown to center of bond pads.

Chip size tolerance: ±0.05 [0.002]

RF ground through backside

Bond Pad #1

Bond Pad #2

Bond Pad #3

Bond Pad #4

Bond Pad #5

Bond Pad #6

Bond Pad #7

Bond Pad #8

Bond Pad #9

Bond Pad #10

Bond Pad #11

RF Input

N/C

VG1

VG2

N/C

N/C

RF Output

N/C

VD

VD

VD

0.11 x 0.19

0.08 x 0.08

0.08 x 0.08

0.08 x 0.08

0.08 x 0.08

0.08 x 0.08

0.11 x 0.19

0.09 x 0.08

0.09 x 0.08

0.09 x 0.08

0.10 x 0.10

.

[0.004 x 0.007]

[0.003 x 0.003]

[0.003 x 0.003]

[0.003 x 0.003]

[0.003 x 0.003]

[0.003 x 0.003]

[0.004 x 0.007]

[0.004 x 0.003]

[0.004 x 0.003]

[0.004 x 0.003]

[0.004 x 0.004]

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

8

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

May 2009 © Rev -

Share Link: