TGA4521 查看數據表（PDF） - TriQuint Semiconductor

零件编号

产品描述 (功能)

比赛名单

TGA4521

32 – 45 GHz Wide Band Driver Amplifier

TriQuint Semiconductor 

Mechanical Drawing

TGA4521

0.750

(0.030)

0.651

(0.026)

0.086 0.267 0.346

(0.003) (0.011) (0.014)

23

4

1.167 1.316

1.490

(0.046) (0.052) (0.059)

5

6

7

0.651

(0.026)

0.353

(0.014)

1

RC

B

9

0

0 0.113

(0.004)

0.793

(0.031)

Units: millimeters (inches)

Thickness: 0.100 (0.004)

Chip edge to bond pad dimensions are shown to center of bond pad

Chip size tolerance: +/- 0.051 (0.002)

GND is back side of MMIC

Bond pad #1

Bond pad #2

Bond pad #3, 9

Bond pad #4, 5, 7

Bond pad #6

Bond pad #8

(RF In)

(N/C)

(Vg)

(Vd)

(N/C)

(RF Out)

0.100 x 0.200

0.081 x 0.100

0.108 x 0.108

0.108 x 0.108

0.091 x 0.084

0.100 x 0.200

(0.004 x 0.008)

(0.003 x 0.004)

(0.004 x 0.004)

(0.004 x 0.004)

(0.004 x 0.003)

(0.004 x 0.008)

0.217

8

(0.009)

1.485 1.600

(0.058) (0.063)

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

7

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

June 2008 © Rev

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