AMMC-5024(2007) 查看數據表（PDF） - Avago Technologies

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AMMC-5024
(Rev.:2007)

30 KHz – 40 GHz Traveling Wave Amplifier

Avago Technologies 

The chip is 100 µm thick and should be handled with

care.

This MMIC has exposed air bridges on the top surface.

Handle at edges or with a custom collet (do not pick up

die with vacuum on die center.)

This MMIC is also static sensitive and ESD handling precau-

tions should be taken.

For more detailed information, see Avago Application

Note 54“GaAs MMIC ESD, Die Attach and Bonding Guide-

lines.”

Notes:

1. Ablebond 84-1 LM1 silver epoxy is recommended.

2. Buckbee-Mears Corporation, St.Paul, MN, 800-262-

3824

Drain Bias

(Vdd)

Vdd AUX

RF_Input

GND

Nine Identical

Second Gate

First Gate

Bias (Vg1)

Figure 19. AMMC-5024 Schematic.

Vdd_AUX Vdd

DET_Reference

DET_Bias

DET_Output GND

0 165 415550 830

1270

2260

1050

960

RF Output

Vg2

485

RF INPUT

235

0

90

733

90

Vg1 2080 2350 GND

2250

Figure 20. AMMC-5024 Bonding Pad Locations. (dimensions in micrometers)

DET_OUT

RF_Output

DET_BIAS

DET_REF



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