AMMC-5024 查看數據表（PDF） - Avago Technologies
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AMMC-5024 Datasheet PDF : 10 Pages
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Vdd_AUX Vdd
DET_Reference
DET_Bias
DET_Output GND
0 165 415550 830
1270
2260
1050
960
RF Output
Vg2
485
RF INPUT
235
0
90
733
90
Vg1 2080 2350 GND
2250
Figure 20. AMMC-5024 Bonding Pad Locations. (dimensions in micrometers)
Drain bias must be decoupled from
RF to lowest operating frequency
4 nH Inductor for operation
to 2 GHz bond wire
100 pF Capacitor
VDD
OUT
IN
VG1
Gate is decoupled from RF.
(Bond wire length is not important)
Figure 21. AMMC-5024 Assembly Diagram.
Ordering Information
AMMC-5024-W10 = 10 devices per tray
AMMC-5024-W50 = 50 devices per tray
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
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Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-3931EN
AV02-0632EN - September 8, 2008
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