BTS425L1 查看數據表（PDF） - Siemens AG
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产品描述 (功能)
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BTS425L1 Datasheet PDF : 12 Pages
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Typ. transient thermal impedance chip case
ZthJC = f(tp)
ZthJC [K/W]
10
1
D=
0.5
0.1
0.2
0.1
0.05
0.02
0.01
0
0.01
1E-5 1E-4 1E-3 1E-2 1E-1 1E0 1E1
tp [s]
Typ. trans. thermal impedance chip to ambient air
ZthJA = f(tp), Device on 50mm * 50mm * 1.5mm epoxy
PCB FR4 with 6cm2 (one layer, 70µm thick) copper
area for Vbb connection. PCB is vertical without blown
air.
ZthJA [K/W]
100
10
D=
0.5
1
0.2
0.1
0.05
0.02
0.01
0
0.1
1E-5 1E-4 1E-3 1E-2 1E-1 1E0 1E1 1E2 1E3
tp [s]
Semiconductor Group
8
BTS 425 L1
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