UPD16901GS 查看數據表（PDF） - NEC => Renesas Technology

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UPD16901GS

FLASH MEMORY VOLTAGE STEPUP DC/DC CONVERTER IC

NEC => Renesas Technology 

µPD16901

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the conditions recommended below.

For soldering methods and conditions other than those recommended, please contact your NEC sales representative.

For details of recommended soldering conditions, refer to the information document "Semiconductor Device

Mounting Technology Manual."

Soldering Method

Soldering Conditions

Infrared reflow

VPS

Wave soldering

Package peak temperature: 235 ˚C; Duration: 30 sec. max. (210 ˚C or above):

Number of times: Max. 3; Time limit: NoneNote

Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less)

is recommended.

Package peak temperature: 215 ˚C; Duration: 40 sec. max. (200 ˚C or above):

Number of times: 1; Time limit: NoneNote

Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less)

is recommended.

Package peak temperature: 260 ˚C or less, Duration: 10 sec. max.,

Preparatory heating temperature: 120 ˚C or less; Number of times: 1

Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less)

is recommended.

Recommended

Condition Symbol

IR35-00-3

VP15-00-1

WS60-00-1

Note For the storage period after unpacking from the dry-pack, storage conditions are max. 25 ˚C, 65% RH.

Caution Use of more than one soldering method should be avoided.

REFERENCE DOCUMENTS

NEC Semiconductor Device Reliability/Quality Control System

Semiconductor Device Quality Guarantee Guide

Semiconductor Device Mounting Technology Manual

10983E

MEI-1202

C10535E

9

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