RMDA20420 查看數據表（PDF） - Fairchild Semiconductor

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RMDA20420

20–42 GHz Broadband Driver Amplifier

Fairchild Semiconductor 

0.0130"

(0.335mm)

0.0275" 0.0365" 0.0465"

(0.700mm) (0.930mm) (1.180mm)

0.0575"

(1.465mm)

0.0249"

(0.630mm)

0.0299"

(0.760mm)

0.0189"

(0.480mm)

0.013"

(0.330mm)

0.0

0.0

0.004"

(0.1mm)

0.0168"

0.028"

(0.430mm) (0.715mm)

0.0475"

(1.200mm)

Back of Chip is RF and DC Ground

0.0185"

(0.465mm)

0.0125"

(0.315mm)

0.0065"

(0.165mm)

0.004"

(0.1mm)

0.0677"

(1.70mm)

0.0064"

(1.620mm)

Figure 2. Chip Layout and Bond Pad Locations

Chip Size = 0.0677" x 0.30" x 0.002" (1720µm x 760µm x 50µm)

BOND WIRE Ls

10,000 pF

DRAIN SUPPLY (Vd)

(Connect to both Vd1 & Vd3)

100 pF

RF IN

MMIC Chip

Vd1 Vg2 alt

Vd2

Vd3

Vd4

Vg1

Vg2

Vg3

Vg4

RF OUT

GROUND

(Back of Chip)

100 pF

BOND WIRE Ls

Note: The Input does not have a

DC blocking capacitor. It is

terminated with a 50Ω

resistor to ground on chip and it

is isolated from any DC bias.

10,000 pF

GATE SUPPLY (Vg)

(VGA and/or VGB)

Note: For currents > 370 mA connect

all four drain pads to the 100pF

capacitor.

Figure 3. Schematic of Application Circuit

©2004 Fairchild Semiconductor Corporation

RMDA20420 Rev. D

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