LT685 查看數據表（PDF） - Linear Technology

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LT685

High Speed Comparator

Linear Technology 

LT685

TYPICAL PERFOR A CE CHARACTERISTICS

Propagation Delays as a Function

of Temperature

12

10

8

6 VOD = 2.5mV

VOD = 5mV

4 VOD = 20mV

VOD = 10mV

2

–50 –25

0 25 50 75 100 125

TEMPERATURE (°C)

LTC685 • TPC01

Hysteresis as a Function of

Temperature

100

90

80

70

60

50

40

30

20

10

0

–50 –25

R = 200Ω

R = 500Ω

R = 1000Ω

0 25 50 75 100 125

TEMPERATURE (°C)

LTC685 • TPC02

PACKAGE DESCRIPTIO

H Package

10-Lead TO-5 Metal Can

(Reference LTC DWG # 05-08-1322)

0.040

(1.016)

MAX

SEATING

PLANE

0.010 – 0.045*

(0.254 – 1.143)

0.335 – 0.370

(8.509 – 9.398)

DIA

0.305 – 0.335

(7.747 – 8.509)

0.050

(1.270)

MAX

0.165 – 0.185

(4.191 – 4.699)

GAUGE

PLANE

0.500 – 0.750

(12.700 – 19.050)

REFERENCE

PLANE

0.016 – 0.021**

(0.406 – 0.533)

36°BSC

0.028 – 0.034

(0.711 – 0.864)

0.027 – 0.045

(0.686 – 1.143)

PIN 1

0.230

( 5.842)

TYP

0.110 – 0.160

(2.794 – 4.064)

INSULATING

STANDOFF

*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE

AND 0.045" BELOW THE REFERENCE PLANE

**FOR

SOLDER

DIP

LEAD

FINISH,

LEAD

DIAMETER

IS

0.016

(0.406

–

–

0.024

0.610)

H10(TO-5) 1197

OBSOLETE PACKAGE

6

685fa

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