PACKAGE DESCRIPTIO
LT685
J Package
16-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
CORNER LEADS OPTION
(4 PLCS)
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.300 BSC
(0.762 BSC)
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
0.005
(0.127)
MIN
0.025
(0.635)
RAD TYP
0.840
(21.336)
MAX
16 15 14 13 12 11 10 9
12
3
4
5
6
78
0.015 – 0.060
(0.380 – 1.520)
0.220 – 0.310
(5.588 – 7.874)
0.200
(5.080)
MAX
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
0.125
(3.175)
MIN
0.045 – 0.065
(1.143 – 1.651)
0.014 – 0.026
(0.360 – 0.660)
OBSOLETE PACKAGE
0.100
(2.54)
BSC
J16 1298
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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