AS1324 查看數據表（PDF） - austriamicrosystems AG
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AS1324 Datasheet PDF : 20 Pages
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AS1324
Data Sheet - Package Drawings and Markings
10 Package Drawings and Markings
The device is available in an 5-pin TSOT-23 package.
Figure 33. 5-pin TSOT-23 Package
Symbol Min
Typ
Max
A
1.00
A1
0.01
0.05
0.10
A2
0.84
0.87
0.90
b
0.30
0.45
b1
0.31
0.35
0.39
c
0.12
0.15
0.20
c1
0.08
0.13
0.16
D
2.90BSC
E
2.80BSC
E1
1.60BSC
e
0.95BSC
e1
1.90BSC
Notes
3,4
3,4
3,4
Symbol Min
Typ
Max
Notes
L
0.30
0.40
0.50
L1
0.60REF
L2
0.25BSC
N
5
R
0.10
R1
0.10
0.25
θ
0º
4º
8º
θ1
4º
10º
12º
Tolerances of Form and Position
aaa
0.15
bbb
0.25
ccc
0.10
ddd
0.20
Notes:
1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994.
2. Dimensions are in millimeters.
3. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall
not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or pro-
trusion shall not exceed 0.15mm per side. Dimensions D and E1 are determined at datum H.
4. The package top can be smaller than the package bottom. Dimensions D and E1 are determined at the outer-
most extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
include any mistmatches between the top of the package body and the bottom. D and E1 are determined at
datum H.
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Revision 1.03
18 - 20
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