CXL5513M 查看數據表（PDF） - Sony Semiconductor

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CXL5513M

CMOS-CCD 1H Delay Line for NTSC

Sony Semiconductor 

Package Outline Unit : mm

CXL5513M

8PIN SOP (PLASTIC)

+ 0.4

5.0 – 0.1

8

5

A

+ 0.4

1.25 – 0.15

0.10

1

+ 0.1

0.4 – 0.05

4

1.27

+ 0.1

0.15 – 0.05

+ 0.15

0.1 – 0.1

SONY CODE

EIAJ CODE

JEDEC CODE

± 0.12 M

SOP-8P-L03

∗SOP008-P-0225-A

0° to 10°

DETAILA

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY / PHENOL RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

42 ALLOY

PACKAGE WEIGHT

0.1g

CXL5513P

8PIN DIP (PLASTIC) 300mil

+ 0.4

9.4 – 0.1

8

5

1

4

2.54

0° to 15°

CXL5513M/P

0.5 ± 0.1

1.2 ± 0.15

SONY CODE

EIAJ CODE

JEDEC CODE

DIP-8P-01

∗DIP008-P-0300-A

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

EPOXY RESIN

SOLDER PLATING

COPPER ALLOY

0.5g

—9—

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