NE960R200 查看數據表（PDF） - NEC => Renesas Technology
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NE960R200 Datasheet PDF : 12 Pages
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NE960R2 SERIES
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Partial Heating
Soldering Conditions
Pin temperature: 260°C
Time: 5 seconds or less (per pin row)
Exposure limit: NoneNote
Recommended Condition Symbol
–
Note After opening the dry pack, keep it in a place below 25°C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
CHIP HANDLING
DIE ATTACHMENT
Die attach can be accomplished with a Au-Sn (300 ±10°C) performs in a forming gas environment. Epoxy die
attach is not recommended.
BONDING
Gate and drain bonding wires should be minimum length, semi-hard gold wire (3 to 8 % elongation) 30 microns or
less in diameter.
Bonding should be performed with a wedge tip that has a taper of approximately 15 %.
Die attach and bonding time should be kept to a minimum. As a general rule, the bonding operation should be
kept within a 280°C_5 minute curve. If longer periods are required, the temperature should be lowered.
PRECAUTIONS
The user must operate in a clean, dry environment.
The chip channel is glassivated for mechanical protection only and does not preclude the necessity of a clean
environment.
The bonding equipment should be periodically checked for sources of surge voltage and should be properly
grounded at all times. In fact, all test and handling equipment should be grounded to minimize the possibilities of
static discharge.
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Preliminary Data Sheet P13775EJ2V0DS00
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