HSP061-4F4 查看數據表（PDF） - STMicroelectronics

零件编号

产品描述 (功能)

比赛名单

HSP061-4F4

4-line ESD protection for high speed lines

STMicroelectronics 

Package information

2

Package information

HSP061-4F4

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 9. Flip Chip dimensions

Ø 140 µm ±15

300 µm ±40

100 µm ±15

1200 µm ±50

Figure 10. Footprint recommendations

(dimensions in mm)

Copper pad Diameter:

130 µm recommended

170 µm maximum

Solder mask opening:

230 µm minimum

Solder stencil opening:

130 µm recommended

380 µm ±20

Figure 11. Marking

Dot,

xx = marking

z = manufacturing

location

yww = datecode

y = year,

ww = week

xxz

y ww

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DocID022207 Rev 2

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