HSP061-4F4 查看數據表（PDF） - STMicroelectronics
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HSP061-4F4 Datasheet PDF : 7 Pages
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Ordering information
3
Ordering information
HSP061-4F4
Figure 13. Ordering information scheme
HSP 06 1 - 4 F4
High speed line protection
Breakdown Voltage
Version
Number of lines
Package
F = Flip Chip
4 = pitch 300 µm, bump height 150 µm
Table 3. Ordering information
Order code
Marking
Package
HSP061-4F4
EW
Flip Chip
Weight
0.5 mg
Base qty
1000
Delivery mode
Tape and reel (7”)
4
Revision history
Date
08-Sep-2011
31-Oct-2013
Table 4. Document revision history
Revision
Changes
1
Initial release.
2
Added package thickness information in Features and Figure 9.
6/7
DocID022207 Rev 2
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