ADT7301ARTZ-REEL7(RevB) 查看數據表（PDF） - Analog Devices

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ADT7301ARTZ-REEL7
(Rev.:RevB)

±1°C Accurate, 13-Bit, Digital Temperature Sensor

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VDD to GND

Digital Input Voltage to GND

Digital Output Voltage to GND

Operating Temperature Range1

Storage Temperature Range

Junction Temperature

−0.3 V to +7 V

−0.3 V to VDD + 0.3 V

−0.3 V to VDD + 0.3 V

−40°C to +150°C

−65°C to +150°C

150°C

6-Lead SOT-23 (RJ-6)

Power Dissipation2

Thermal Impedance

WMAX = (TJ max − TA3)/θJA

θJA, Junction-to-Ambient

(Still Air)

190.4°C/W

8-Lead MSOP (RM-8)

Power Dissipation2

Thermal Impedance4

WMAX = (TJ max − TA3)/θJA

θJA, Junction-to-Ambient

(Still Air)

θJC, Junction-to-Case

IR Reflow Soldering

Peak Temperature

Time at Peak Temperature

Ramp-Up Rate

205.9°C/W

43.74°C/W

220°C (0°C/5°C)

10 sec to 20 sec

3°C/s max

Ramp-Down Rate

−6°C/s max

Time 25°C to Peak Temperature

6 minutes max

IR Reflow Soldering—Pb-Free Package

Peak Temperature

260°C (0°C)

Time at Peak Temperature

Ramp-Up Rate

20 sec to 40 sec

3°C/s max

Ramp-Down Rate

Time 25°C to Peak Temperature

−6°C/s max

8 minutes max

1 It is not recommended to operate the ADT7301 at temperatures above

125°C for greater than a total of 5% (5,000 hours) of the lifetime of the

device. Any exposure beyond this limit affects device reliability.

2 Values relate to the package being used on a standard 2-layer PCB. Refer

to Figure 3 for a plot of maximum power dissipation vs. ambient

temperature (TA).

3 TA = ambient temperature.

4 Junction-to-case resistance is applicable to components featuring a

preferential flow direction, for example, components mounted on a heat

sink. Junction-to-ambient resistance is more useful for air-cooled,

PCB-mounted components.

ADT7301

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

1.2

1.0

0.8

SOT-23

0.6

0.4

MSOP

0.2

0

TEMPERATURE (°C)

Figure 3. Plot of Maximum Power Dissipation vs. Temperature

ESD CAUTION

Rev. B | Page 5 of 16

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