HMC561 查看數據表（PDF） - Analog Devices
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HMC561 Datasheet PDF : 6 Pages
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Outline Drawing
HMC561
v04.0714
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 8 - 21 GHz OUTPUT
Die Packaging Information [1]
Standard
Alternate [2]
GP-2 (Gel Pack)
—
[1] R efer to the “Packaging Information” section for die
packaging dimensions.
[2] Reference this suffix only when ordering alternate die
packaging.
Pad Descriptions
Pad Number
Function
Description
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE.
4. TYPICAL BOND SPACING IS .006” CENTER TO CENTER.
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METALIZATION: GOLD
7. BACKSIDE METAL IS GROUND.
8. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS.
Interface Schematic
1, 4, 8
GND
Die bottom must be connected to RF ground.
2
RFIN
This pad is AC coupled and matched to 50 Ohms.
Gate control for multiplier. Adjust to achieve Idd
3
Vgg
of 98 mA. Please follow “MMIC Amplifier Biasing
Procedure” Application note.
5, 6
Vdd1, Vdd2
Supply voltage 5V ± 0.5V.
7
RFOUT
This pad is AC coupled and matched to 50 Ohms.
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